%0 Conference Paper %1 conf/icmens/NaKLKLC06 %A Na, Kyounghwan %A hwan Kim, Il %A Lee, Eunsung %A Kim, Hyeon Cheol %A Lee, Yong-Hwan %A Chun, Kukjin %B ICMENS %D 2006 %I IEEE %K dblp %P 31-34 %T Wafer Level Package Using Polymer Bonding of Thick SU-8 Photoresist. %U http://dblp.uni-trier.de/db/conf/icmens/icmens2006.html#NaKLKLC06 %@ 1-4244-0899-7

@inproceedings{conf/icmens/NaKLKLC06, added-at = {2014-10-23T00:00:00.000+0200}, author = {Na, Kyounghwan and hwan Kim, Il and Lee, Eunsung and Kim, Hyeon Cheol and Lee, Yong-Hwan and Chun, Kukjin}, biburl = {https://www.bibsonomy.org/bibtex/2a307476fe60ab1adf38945c87598da80/dblp}, booktitle = {ICMENS}, crossref = {conf/icmens/2006}, ee = {http://dx.doi.org/10.1109/ICMENS.2006.348211}, interhash = {74601db8b6ddc97b407a37d3de9ac632}, intrahash = {a307476fe60ab1adf38945c87598da80}, isbn = {1-4244-0899-7}, keywords = {dblp}, pages = {31-34}, publisher = {IEEE}, timestamp = {2015-06-19T23:59:26.000+0200}, title = {Wafer Level Package Using Polymer Bonding of Thick SU-8 Photoresist.}, url = {http://dblp.uni-trier.de/db/conf/icmens/icmens2006.html#NaKLKLC06}, year = 2006 }