%0 Journal Article %1 journals/mr/ParkSK17 %A Park, Dong Hyun %A Shin, Sojin %A Kim, Yeong K. %D 2017 %J Microelectron. Reliab. %K dblp %P 328-335 %T Module packaging effects on MEMS airbag sensor performance for automobiles. %U http://dblp.uni-trier.de/db/journals/mr/mr79.html#ParkSK17 %V 79

@article{journals/mr/ParkSK17, added-at = {2020-02-22T00:00:00.000+0100}, author = {Park, Dong Hyun and Shin, Sojin and Kim, Yeong K.}, biburl = {https://www.bibsonomy.org/bibtex/22530b115d1b17e6204a4cec29df5ca67/dblp}, ee = {https://doi.org/10.1016/j.microrel.2017.07.051}, interhash = {7f48594ce8137fdf35852feb26064511}, intrahash = {2530b115d1b17e6204a4cec29df5ca67}, journal = {Microelectron. Reliab.}, keywords = {dblp}, pages = {328-335}, timestamp = {2020-02-25T13:23:02.000+0100}, title = {Module packaging effects on MEMS airbag sensor performance for automobiles.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr79.html#ParkSK17}, volume = 79, year = 2017 }