%0 Journal Article %1 journals/tcad/LinHTCSCK13 %A Lin, Yu-Hsiang %A Huang, Shi-Yu %A Tsai, Kun-Han %A Cheng, Wu-Tung %A Sunter, Stephen K. %A Chou, Yung-Fa %A Kwai, Ding-Ming %D 2013 %J IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. %K dblp %N 5 %P 737-747 %T Parametric Delay Test of Post-Bond Through-Silicon Vias in 3-D ICs via Variable Output Thresholding Analysis. %U http://dblp.uni-trier.de/db/journals/tcad/tcad32.html#LinHTCSCK13 %V 32

@article{journals/tcad/LinHTCSCK13, added-at = {2020-09-24T00:00:00.000+0200}, author = {Lin, Yu-Hsiang and Huang, Shi-Yu and Tsai, Kun-Han and Cheng, Wu-Tung and Sunter, Stephen K. and Chou, Yung-Fa and Kwai, Ding-Ming}, biburl = {https://www.bibsonomy.org/bibtex/2b29c7676851388c189fe7a7d855dd0c9/dblp}, ee = {https://doi.org/10.1109/TCAD.2012.2236837}, interhash = {7fcb348534c6745103023148467c9190}, intrahash = {b29c7676851388c189fe7a7d855dd0c9}, journal = {IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.}, keywords = {dblp}, number = 5, pages = {737-747}, timestamp = {2020-09-25T11:45:41.000+0200}, title = {Parametric Delay Test of Post-Bond Through-Silicon Vias in 3-D ICs via Variable Output Thresholding Analysis.}, url = {http://dblp.uni-trier.de/db/journals/tcad/tcad32.html#LinHTCSCK13}, volume = 32, year = 2013 }