%0 Conference Paper %1 conf/3dic/SakuiO19 %A Sakui, Koji %A Ohba, Takayuki %B 3DIC %D 2019 %I IEEE %K dblp %P 1-4 %T High Bandwidth Memory (HBM) and High Bandwidth NAND (HBN) with the Bumpless TSV Technology. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2019.html#SakuiO19 %@ 978-1-7281-4870-0

@inproceedings{conf/3dic/SakuiO19, added-at = {2020-04-19T00:00:00.000+0200}, author = {Sakui, Koji and Ohba, Takayuki}, biburl = {https://www.bibsonomy.org/bibtex/2550fdcbe292f34d3c7816cb4f302e61c/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2019}, ee = {https://doi.org/10.1109/3DIC48104.2019.9058900}, interhash = {81ac18157e3f1445b3f0664614033560}, intrahash = {550fdcbe292f34d3c7816cb4f302e61c}, isbn = {978-1-7281-4870-0}, keywords = {dblp}, pages = {1-4}, publisher = {IEEE}, timestamp = {2020-04-21T11:41:02.000+0200}, title = {High Bandwidth Memory (HBM) and High Bandwidth NAND (HBN) with the Bumpless TSV Technology.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2019.html#SakuiO19}, year = 2019 }