%0 Conference Paper %1 conf/isocc/JinOK22a %A Jin, Myeongwoo %A Oh, Doekkeun %A Kim, Juho %B ISOCC %D 2022 %I IEEE %K dblp %P 388-389 %T Delay Impact on Process Variation of Interconnect throughout technology scaling. %U http://dblp.uni-trier.de/db/conf/isocc/isocc2022.html#JinOK22a %@ 978-1-6654-5971-6

@inproceedings{conf/isocc/JinOK22a, added-at = {2023-02-15T00:00:00.000+0100}, author = {Jin, Myeongwoo and Oh, Doekkeun and Kim, Juho}, biburl = {https://www.bibsonomy.org/bibtex/272213a1290aed42db391e3e8636103d7/dblp}, booktitle = {ISOCC}, crossref = {conf/isocc/2022}, ee = {https://doi.org/10.1109/ISOCC56007.2022.10031498}, interhash = {860346a5494178e6eed8c5ecdaa431f8}, intrahash = {72213a1290aed42db391e3e8636103d7}, isbn = {978-1-6654-5971-6}, keywords = {dblp}, pages = {388-389}, publisher = {IEEE}, timestamp = {2024-04-09T23:34:16.000+0200}, title = {Delay Impact on Process Variation of Interconnect throughout technology scaling.}, url = {http://dblp.uni-trier.de/db/conf/isocc/isocc2022.html#JinOK22a}, year = 2022 }