%0 Conference Paper %1 conf/itc/MarinissenZ09 %A Marinissen, Erik Jan %A Zorian, Yervant %B ITC %D 2009 %E Roberts, Gordon W. %E Eklow, Bill %I IEEE Computer Society %K dblp %P 1-11 %T Testing 3D chips containing through-silicon vias. %U http://dblp.uni-trier.de/db/conf/itc/itc2009.html#MarinissenZ09 %@ 978-1-4244-4868-5

@inproceedings{conf/itc/MarinissenZ09, added-at = {2024-02-05T00:00:00.000+0100}, author = {Marinissen, Erik Jan and Zorian, Yervant}, biburl = {https://www.bibsonomy.org/bibtex/239b2a1e1d1d7a295ae2bcc7764fe0a9e/dblp}, booktitle = {ITC}, crossref = {conf/itc/2009}, editor = {Roberts, Gordon W. and Eklow, Bill}, ee = {https://doi.ieeecomputersociety.org/10.1109/TEST.2009.5355573}, interhash = {89b0d6e0d95720a4a035beb32d569c3b}, intrahash = {39b2a1e1d1d7a295ae2bcc7764fe0a9e}, isbn = {978-1-4244-4868-5}, keywords = {dblp}, pages = {1-11}, publisher = {IEEE Computer Society}, timestamp = {2024-04-10T04:29:19.000+0200}, title = {Testing 3D chips containing through-silicon vias.}, url = {http://dblp.uni-trier.de/db/conf/itc/itc2009.html#MarinissenZ09}, year = 2009 }