%0 Conference Paper %1 conf/smc/ChangCLJ09 %A Chang, Chuan-Yu %A Chang, Yung-Chi %A Li, ChunHsi %A Jeng, MuDer %B SMC %D 2009 %I IEEE %K dblp %P 1615-1620 %T Automatic Die Inspection for Post-sawing LED Wafers. %U http://dblp.uni-trier.de/db/conf/smc/smc2009.html#ChangCLJ09 %@ 978-1-4244-2794-9

@inproceedings{conf/smc/ChangCLJ09, added-at = {2017-05-17T00:00:00.000+0200}, author = {Chang, Chuan-Yu and Chang, Yung-Chi and Li, ChunHsi and Jeng, MuDer}, biburl = {https://www.bibsonomy.org/bibtex/2a866dffcc98347794d240bd6b06995a4/dblp}, booktitle = {SMC}, crossref = {conf/smc/2009}, ee = {https://doi.org/10.1109/ICSMC.2009.5346751}, interhash = {8f19964fade2ea52834e0685e9aff7d8}, intrahash = {a866dffcc98347794d240bd6b06995a4}, isbn = {978-1-4244-2794-9}, keywords = {dblp}, pages = {1615-1620}, publisher = {IEEE}, timestamp = {2019-10-17T22:31:38.000+0200}, title = {Automatic Die Inspection for Post-sawing LED Wafers.}, url = {http://dblp.uni-trier.de/db/conf/smc/smc2009.html#ChangCLJ09}, year = 2009 }