%0 Conference Paper %1 conf/date/WuWDHYY14 %A Wu, Sih-Sian %A Wang, Kanwen %A Dinakarrao, Sai Manoj Pudukotai %A Ho, Tsung-Yi %A Yu, Mingbin %A Yu, Hao %B DATE %D 2014 %E Fettweis, Gerhard P. %E Nebel, Wolfgang %I European Design and Automation Association %K dblp %P 1-4 %T A thermal resilient integration of many-core microprocessors and main memory by 2.5D TSI I/Os. %U http://dblp.uni-trier.de/db/conf/date/date2014.html#WuWDHYY14 %@ 978-3-9815370-2-4

@inproceedings{conf/date/WuWDHYY14, added-at = {2019-09-25T00:00:00.000+0200}, author = {Wu, Sih-Sian and Wang, Kanwen and Dinakarrao, Sai Manoj Pudukotai and Ho, Tsung-Yi and Yu, Mingbin and Yu, Hao}, biburl = {https://www.bibsonomy.org/bibtex/26aa985ee4b2fc3b554eeedd8ea398ca3/dblp}, booktitle = {DATE}, crossref = {conf/date/2014}, editor = {Fettweis, Gerhard P. and Nebel, Wolfgang}, ee = {http://dl.acm.org/citation.cfm?id=2616824}, interhash = {91051df780f5608723f7b33a9baea2d5}, intrahash = {6aa985ee4b2fc3b554eeedd8ea398ca3}, isbn = {978-3-9815370-2-4}, keywords = {dblp}, pages = {1-4}, publisher = {European Design and Automation Association}, timestamp = {2019-10-17T15:02:54.000+0200}, title = {A thermal resilient integration of many-core microprocessors and main memory by 2.5D TSI I/Os.}, url = {http://dblp.uni-trier.de/db/conf/date/date2014.html#WuWDHYY14}, year = 2014 }