%0 Journal Article %1 journals/mr/AminLSRA09 %A Amin, Nowshad %A Lim, Victor %A Seng, Foong Chee %A Razid, Rozaidi %A Ahmad, Ibrahim %D 2009 %J Microelectron. Reliab. %K dblp %N 5 %P 537-543 %T A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages. %U http://dblp.uni-trier.de/db/journals/mr/mr49.html#AminLSRA09 %V 49

@article{journals/mr/AminLSRA09, added-at = {2020-02-22T00:00:00.000+0100}, author = {Amin, Nowshad and Lim, Victor and Seng, Foong Chee and Razid, Rozaidi and Ahmad, Ibrahim}, biburl = {https://www.bibsonomy.org/bibtex/2975f4e905652b9923d9b586ed6dfc420/dblp}, ee = {https://doi.org/10.1016/j.microrel.2009.02.013}, interhash = {968e08b77ab3035cfc8bcd6f799b9731}, intrahash = {975f4e905652b9923d9b586ed6dfc420}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 5, pages = {537-543}, timestamp = {2020-02-25T13:24:46.000+0100}, title = {A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr49.html#AminLSRA09}, volume = 49, year = 2009 }