%0 Conference Paper %1 conf/dese/MackowiakALEBNZ19 %A Mackowiak, Piotr %A Al-Magazachi, Samer %A Lang, Klaus-Dieter %A Erbacher, Kolja %A Bäuscher, Manuel %A Ngo, Ha-Duong %A Zoschke, Kai %A Schiffer, Michael %B DeSE %D 2019 %I IEEE %K dblp %P 902-905 %T Ultra Thin Force and Acceleration Sensor Embedded in Flexible Thin Film Substrates Using Thin Chip Handling, Bonding and Carrier Release Technologies. %U http://dblp.uni-trier.de/db/conf/dese/dese2019.html#MackowiakALEBNZ19 %@ 978-1-7281-3021-7

@inproceedings{conf/dese/MackowiakALEBNZ19, added-at = {2021-10-14T00:00:00.000+0200}, author = {Mackowiak, Piotr and Al-Magazachi, Samer and Lang, Klaus-Dieter and Erbacher, Kolja and Bäuscher, Manuel and Ngo, Ha-Duong and Zoschke, Kai and Schiffer, Michael}, biburl = {https://www.bibsonomy.org/bibtex/20f63aff0ad02ec1c9e845cadbdd5353a/dblp}, booktitle = {DeSE}, crossref = {conf/dese/2019}, ee = {https://doi.org/10.1109/DeSE.2019.00167}, interhash = {a5db9cc526326fb405c7af87bec0ce66}, intrahash = {0f63aff0ad02ec1c9e845cadbdd5353a}, isbn = {978-1-7281-3021-7}, keywords = {dblp}, pages = {902-905}, publisher = {IEEE}, timestamp = {2024-04-10T06:16:53.000+0200}, title = {Ultra Thin Force and Acceleration Sensor Embedded in Flexible Thin Film Substrates Using Thin Chip Handling, Bonding and Carrier Release Technologies.}, url = {http://dblp.uni-trier.de/db/conf/dese/dese2019.html#MackowiakALEBNZ19}, year = 2019 }