%0 Conference Paper %1 conf/itc-asia/LeeHKK20 %A Lee, Hayoung %A Han, Donghyun %A Kim, Hogyeong %A Kang, Sungho %B ITC-Asia %D 2020 %I IEEE %K dblp %P 94-99 %T W-ERA: One-Time Memory Repair with Wafer-Level Early Repair Analysis for Cost Reduction. %U http://dblp.uni-trier.de/db/conf/itc-asia/itc-asia2020.html#LeeHKK20 %@ 978-1-7281-8944-4

@inproceedings{conf/itc-asia/LeeHKK20, added-at = {2024-02-27T00:00:00.000+0100}, author = {Lee, Hayoung and Han, Donghyun and Kim, Hogyeong and Kang, Sungho}, biburl = {https://www.bibsonomy.org/bibtex/2241f90d85b4e952e10d70d3e623e209b/dblp}, booktitle = {ITC-Asia}, crossref = {conf/itc-asia/2020}, ee = {https://doi.org/10.1109/ITC-Asia51099.2020.00028}, interhash = {af4f516c053c8aa2e8f2cb48a798c177}, intrahash = {241f90d85b4e952e10d70d3e623e209b}, isbn = {978-1-7281-8944-4}, keywords = {dblp}, pages = {94-99}, publisher = {IEEE}, timestamp = {2024-04-10T16:31:59.000+0200}, title = {W-ERA: One-Time Memory Repair with Wafer-Level Early Repair Analysis for Cost Reduction.}, url = {http://dblp.uni-trier.de/db/conf/itc-asia/itc-asia2020.html#LeeHKK20}, year = 2020 }