%0 Conference Paper %1 conf/3dic/GotoHIOSKHTH15 %A Goto, Masahide %A Hagiwara, Kei %A Iguchi, Yoshinori %A Ohtake, Hiroshi %A Saraya, Takuya %A Kobayashi, Masaharu %A Higurashi, Eiji %A Toshiyoshi, Hiroshi %A Hiramoto, Toshiro %B 3DIC %D 2015 %I IEEE %K dblp %P TS9.2.1-TS9.2.4 %T Three-dimensional integrated circuits and stacked CMOS image sensors using direct bonding of SOI layers. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#GotoHIOSKHTH15 %@ 978-1-4673-9385-0

@inproceedings{conf/3dic/GotoHIOSKHTH15, added-at = {2021-10-14T00:00:00.000+0200}, author = {Goto, Masahide and Hagiwara, Kei and Iguchi, Yoshinori and Ohtake, Hiroshi and Saraya, Takuya and Kobayashi, Masaharu and Higurashi, Eiji and Toshiyoshi, Hiroshi and Hiramoto, Toshiro}, biburl = {https://www.bibsonomy.org/bibtex/2c746859e1db58309eae8fa0b15ed9b35/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2015}, ee = {https://doi.org/10.1109/3DIC.2015.7334562}, interhash = {b85c665edefe46393307f112becc673e}, intrahash = {c746859e1db58309eae8fa0b15ed9b35}, isbn = {978-1-4673-9385-0}, keywords = {dblp}, pages = {TS9.2.1-TS9.2.4}, publisher = {IEEE}, timestamp = {2024-04-10T12:10:59.000+0200}, title = {Three-dimensional integrated circuits and stacked CMOS image sensors using direct bonding of SOI layers.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#GotoHIOSKHTH15}, year = 2015 }