%0 Conference Paper %1 conf/rws/PavlidisWP17 %A Pavlidis, Spyridon %A Wright, Brian %A Papapolymerou, John %B RWS %D 2017 %I IEEE %K dblp %P 79-82 %T 3-D printed substrates for MMIC packaging. %U http://dblp.uni-trier.de/db/conf/rws/rws2017.html#PavlidisWP17 %@ 978-1-5090-3446-8

@inproceedings{conf/rws/PavlidisWP17, added-at = {2017-03-31T00:00:00.000+0200}, author = {Pavlidis, Spyridon and Wright, Brian and Papapolymerou, John}, biburl = {https://www.bibsonomy.org/bibtex/2cd68b9db0080ed6b2069435a105ed93c/dblp}, booktitle = {RWS}, crossref = {conf/rws/2017}, ee = {http://dx.doi.org/10.1109/RWS.2017.7885951}, interhash = {bd679e92b82cd792d6de25d99540d8ed}, intrahash = {cd68b9db0080ed6b2069435a105ed93c}, isbn = {978-1-5090-3446-8}, keywords = {dblp}, pages = {79-82}, publisher = {IEEE}, timestamp = {2017-04-01T11:35:36.000+0200}, title = {3-D printed substrates for MMIC packaging.}, url = {http://dblp.uni-trier.de/db/conf/rws/rws2017.html#PavlidisWP17}, year = 2017 }