%0 Conference Paper %1 conf/3dic/TsaiKLAF09 %A Tsai, Menglin %A Klooz, Amy %A Leonard, Alexander %A Appel, Jennie %A Franzon, Paul D. %B 3DIC %D 2009 %I IEEE %K dblp %P 1-8 %T Through Silicon Via(TSV) defect/pinhole self test circuit for 3D-IC. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2009.html#TsaiKLAF09 %@ 978-1-4244-4512-7

@inproceedings{conf/3dic/TsaiKLAF09, added-at = {2017-05-21T00:00:00.000+0200}, author = {Tsai, Menglin and Klooz, Amy and Leonard, Alexander and Appel, Jennie and Franzon, Paul D.}, biburl = {https://www.bibsonomy.org/bibtex/227ccf6d4c0ad343e55b3eb430defc9a5/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2009}, ee = {https://doi.org/10.1109/3DIC.2009.5306569}, interhash = {cbcf48dadae85df2658c76ce3aaf93de}, intrahash = {27ccf6d4c0ad343e55b3eb430defc9a5}, isbn = {978-1-4244-4512-7}, keywords = {dblp}, pages = {1-8}, publisher = {IEEE}, timestamp = {2019-10-17T15:31:22.000+0200}, title = {Through Silicon Via(TSV) defect/pinhole self test circuit for 3D-IC.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2009.html#TsaiKLAF09}, year = 2009 }