%0 Conference Paper %1 conf/vlsit/ZhangLHLHWDCCWS22 %A Zhang, Jie %A Lu, Wei %A Huang, Po-Tsang %A Li, Sih-Han %A Hung, Tsung-Yi %A Wu, Shih-Hsien %A Dai, Ming-Ji %A Chung, I-Shan %A Chen, Wen-Chao %A Wang, Chin-Hung %A Sheu, Shyh-Shyuan %A Chen, Hung-Ming %A Chen, Kuan-Neng %A Lo, Wei-Chung %A Wu, Chih-I %B VLSI Technology and Circuits %D 2022 %I IEEE %K dblp %P 262-263 %T An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-Prototype Programmable 2.5D/3D Packaging Technology. %U http://dblp.uni-trier.de/db/conf/vlsit/vlsit2022.html#ZhangLHLHWDCCWS22 %@ 978-1-6654-9772-5

@inproceedings{conf/vlsit/ZhangLHLHWDCCWS22, added-at = {2022-08-04T00:00:00.000+0200}, author = {Zhang, Jie and Lu, Wei and Huang, Po-Tsang and Li, Sih-Han and Hung, Tsung-Yi and Wu, Shih-Hsien and Dai, Ming-Ji and Chung, I-Shan and Chen, Wen-Chao and Wang, Chin-Hung and Sheu, Shyh-Shyuan and Chen, Hung-Ming and Chen, Kuan-Neng and Lo, Wei-Chung and Wu, Chih-I}, biburl = {https://www.bibsonomy.org/bibtex/210a617dcc3749900c6bd47176ff1e726/dblp}, booktitle = {VLSI Technology and Circuits}, crossref = {conf/vlsit/2022}, ee = {https://doi.org/10.1109/VLSITechnologyandCir46769.2022.9830188}, interhash = {d8a7a2bb0c0e946affd5060b05c95c10}, intrahash = {10a617dcc3749900c6bd47176ff1e726}, isbn = {978-1-6654-9772-5}, keywords = {dblp}, pages = {262-263}, publisher = {IEEE}, timestamp = {2024-04-09T19:13:06.000+0200}, title = {An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-Prototype Programmable 2.5D/3D Packaging Technology.}, url = {http://dblp.uni-trier.de/db/conf/vlsit/vlsit2022.html#ZhangLHLHWDCCWS22}, year = 2022 }