%0 Journal Article %1 journals/mr/LiuLIL08 %A Liu, Yong %A Liang, Lihua %A Irving, Scott %A Luk, Timwah %D 2008 %J Microelectron. Reliab. %K dblp %N 6 %P 811-824 %T 3D Modeling of electromigration combined with thermal-mechanical effect for IC device and package. %U http://dblp.uni-trier.de/db/journals/mr/mr48.html#LiuLIL08 %V 48

@article{journals/mr/LiuLIL08, added-at = {2020-10-26T00:00:00.000+0100}, author = {Liu, Yong and Liang, Lihua and Irving, Scott and Luk, Timwah}, biburl = {https://www.bibsonomy.org/bibtex/2f7557f73a95cd1002ad1af3000255247/dblp}, ee = {https://doi.org/10.1016/j.microrel.2008.03.021}, interhash = {d8f1db57d0a51395da516d2308d988fc}, intrahash = {f7557f73a95cd1002ad1af3000255247}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 6, pages = {811-824}, timestamp = {2020-10-27T12:44:32.000+0100}, title = {3D Modeling of electromigration combined with thermal-mechanical effect for IC device and package.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr48.html#LiuLIL08}, volume = 48, year = 2008 }