%0 Journal Article %1 journals/access/LinW23 %A Lin, Yu-Kun %A Wu, Bing-Fei %D 2023 %J IEEE Access %K dblp %P 21252-21263 %T Time-Series Forecast-Based Endpoint Thickness Compensation for Thinning of Sapphire Wafer. %U http://dblp.uni-trier.de/db/journals/access/access11.html#LinW23 %V 11

@article{journals/access/LinW23, added-at = {2023-03-28T00:00:00.000+0200}, author = {Lin, Yu-Kun and Wu, Bing-Fei}, biburl = {https://www.bibsonomy.org/bibtex/212027b1143c8a5eac3dbdc8a2c84048d/dblp}, ee = {https://doi.org/10.1109/ACCESS.2023.3247430}, interhash = {d929df51871a0f3fc66f94fe905670a9}, intrahash = {12027b1143c8a5eac3dbdc8a2c84048d}, journal = {IEEE Access}, keywords = {dblp}, pages = {21252-21263}, timestamp = {2024-04-08T14:07:31.000+0200}, title = {Time-Series Forecast-Based Endpoint Thickness Compensation for Thinning of Sapphire Wafer.}, url = {http://dblp.uni-trier.de/db/journals/access/access11.html#LinW23}, volume = 11, year = 2023 }