%0 Journal Article %1 journals/mr/JinkaDGL09 %A Jinka, K. K. %A Dasgupta, A. %A Ganesan, S. %A Ling, S. %D 2009 %J Microelectron. Reliab. %K dblp %N 5 %P 523-529 %T Chip-on board technology for low temperature environment. Part II: Thermomechanical stresses in encapsulated ball-wedge bond wires. %U http://dblp.uni-trier.de/db/journals/mr/mr49.html#JinkaDGL09 %V 49

@article{journals/mr/JinkaDGL09, added-at = {2020-02-22T00:00:00.000+0100}, author = {Jinka, K. K. and Dasgupta, A. and Ganesan, S. and Ling, S.}, biburl = {https://www.bibsonomy.org/bibtex/2236908b5960f3e2ee6485f3c12c15f8a/dblp}, ee = {https://doi.org/10.1016/j.microrel.2009.02.008}, interhash = {e1e187a48bb2e5e6d1e31b9b15aa03c6}, intrahash = {236908b5960f3e2ee6485f3c12c15f8a}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 5, pages = {523-529}, timestamp = {2020-02-25T13:27:55.000+0100}, title = {Chip-on board technology for low temperature environment. Part II: Thermomechanical stresses in encapsulated ball-wedge bond wires.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr49.html#JinkaDGL09}, volume = 49, year = 2009 }