%0 Conference Paper %1 conf/3dic/FukushimaIMBLCT14 %A Fukushima, Takafumi %A Ito, Yuka %A Murugesan, Mariappan %A Bea, Jicheol %A Lee, Kang Wook %A Choki, Koji %A Tanaka, Tetsu %A Koyanagi, Mitsumasa %B 3DIC %D 2014 %I IEEE %K dblp %P 1-4 %T Tiny VCSEL chip self-assembly for advanced chip-to-wafer 3D and hetero integration. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2014.html#FukushimaIMBLCT14 %@ 978-1-4799-8472-5

@inproceedings{conf/3dic/FukushimaIMBLCT14, added-at = {2021-02-16T00:00:00.000+0100}, author = {Fukushima, Takafumi and Ito, Yuka and Murugesan, Mariappan and Bea, Jicheol and Lee, Kang Wook and Choki, Koji and Tanaka, Tetsu and Koyanagi, Mitsumasa}, biburl = {https://www.bibsonomy.org/bibtex/24641706c15c5ce03ab766eea0f4938f3/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2014}, ee = {https://doi.org/10.1109/3DIC.2014.7152145}, interhash = {e270b8e6b8d78fd7a9e85bca350c98bb}, intrahash = {4641706c15c5ce03ab766eea0f4938f3}, isbn = {978-1-4799-8472-5}, keywords = {dblp}, pages = {1-4}, publisher = {IEEE}, timestamp = {2024-04-10T12:10:53.000+0200}, title = {Tiny VCSEL chip self-assembly for advanced chip-to-wafer 3D and hetero integration.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2014.html#FukushimaIMBLCT14}, year = 2014 }