%0 Conference Paper %1 conf/3dic/TehCQAOGMSMCWMGD09 %A Teh, Weng Hong %A Caramto, Raymond %A Qureshi, Jamal %A Arkalgud, Sitaram %A O'Brien, M. %A Gilday, T. %A Maekawa, Kou %A Saito, T. %A Maruyama, Kouichi %A Chidambaram, Thenappan %A Wang, Wei %A Marx, David %A Grant, David %A Dudley, Russ %B 3DIC %D 2009 %I IEEE %K dblp %P 1-5 %T A route towards production-worthy 5 µm × 25 µm and 1 µm × 20 µm non-Bosch through-silicon-via (TSV) etch, TSV metrology, and TSV integration. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2009.html#TehCQAOGMSMCWMGD09 %@ 978-1-4244-4512-7

@inproceedings{conf/3dic/TehCQAOGMSMCWMGD09, added-at = {2017-05-21T00:00:00.000+0200}, author = {Teh, Weng Hong and Caramto, Raymond and Qureshi, Jamal and Arkalgud, Sitaram and O'Brien, M. and Gilday, T. and Maekawa, Kou and Saito, T. and Maruyama, Kouichi and Chidambaram, Thenappan and Wang, Wei and Marx, David and Grant, David and Dudley, Russ}, biburl = {https://www.bibsonomy.org/bibtex/26b3081a67e3b7209fe2dd074d4ac966e/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2009}, ee = {https://doi.org/10.1109/3DIC.2009.5306562}, interhash = {e804661287d3e56e87b8d5438d79e21c}, intrahash = {6b3081a67e3b7209fe2dd074d4ac966e}, isbn = {978-1-4244-4512-7}, keywords = {dblp}, pages = {1-5}, publisher = {IEEE}, timestamp = {2019-10-17T15:31:22.000+0200}, title = {A route towards production-worthy 5 µm × 25 µm and 1 µm × 20 µm non-Bosch through-silicon-via (TSV) etch, TSV metrology, and TSV integration.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2009.html#TehCQAOGMSMCWMGD09}, year = 2009 }