%0 Conference Paper %1 conf/embc/KimWCC19 %A Kim, Sung-Woo %A Won, Young-Jun %A Chae, Dong-Sik %A Chang, Hyuk-Jae %B EMBC %D 2019 %I IEEE %K dblp %P 3486-3489 %T A New Fracture Liaison Service Using the Mobile Application and IoT Sensor. %U http://dblp.uni-trier.de/db/conf/embc/embc2019.html#KimWCC19 %@ 978-1-5386-1311-5

@inproceedings{conf/embc/KimWCC19, added-at = {2020-09-05T00:00:00.000+0200}, author = {Kim, Sung-Woo and Won, Young-Jun and Chae, Dong-Sik and Chang, Hyuk-Jae}, biburl = {https://www.bibsonomy.org/bibtex/266359af42a112c36a2834b017adb781e/dblp}, booktitle = {EMBC}, crossref = {conf/embc/2019}, ee = {https://www.wikidata.org/entity/Q92697529}, interhash = {e9a467d27b3d20f2f847fdd79922e8f3}, intrahash = {66359af42a112c36a2834b017adb781e}, isbn = {978-1-5386-1311-5}, keywords = {dblp}, pages = {3486-3489}, publisher = {IEEE}, timestamp = {2020-09-09T14:00:21.000+0200}, title = {A New Fracture Liaison Service Using the Mobile Application and IoT Sensor.}, url = {http://dblp.uni-trier.de/db/conf/embc/embc2019.html#KimWCC19}, year = 2019 }