%0 Journal Article %1 journals/tcad/YaoPAFH13 %A Yao, Wei %A Pan, Siming %A Achkir, Brice %A Fan, Jun %A He, Lei %D 2013 %J IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. %K dblp %N 4 %P 487-496 %T Modeling and Application of Multi-Port TSV Networks in 3-D IC. %U http://dblp.uni-trier.de/db/journals/tcad/tcad32.html#YaoPAFH13 %V 32

@article{journals/tcad/YaoPAFH13, added-at = {2021-05-28T00:00:00.000+0200}, author = {Yao, Wei and Pan, Siming and Achkir, Brice and Fan, Jun and He, Lei}, biburl = {https://www.bibsonomy.org/bibtex/29babf34cae307a2e828d5a1b9dd93b27/dblp}, ee = {https://doi.org/10.1109/TCAD.2012.2228740}, interhash = {ede02b9f94fe590f420bd628b3a6a96c}, intrahash = {9babf34cae307a2e828d5a1b9dd93b27}, journal = {IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.}, keywords = {dblp}, number = 4, pages = {487-496}, timestamp = {2024-04-08T19:47:00.000+0200}, title = {Modeling and Application of Multi-Port TSV Networks in 3-D IC.}, url = {http://dblp.uni-trier.de/db/journals/tcad/tcad32.html#YaoPAFH13}, volume = 32, year = 2013 }