%0 Conference Paper %1 conf/ieeesensors/SinghC22 %A Singh, Rajababu Udainarayan %A Conde, Miguel Heredia %B IEEE SENSORS %D 2022 %I IEEE %K dblp %P 1-4 %T Robust Time-of-Flight-based Material Imaging using Three-Dimensional Deep Neural Networks on Spatial Neighborhoods of Pixels. %U http://dblp.uni-trier.de/db/conf/ieeesensors/ieeesensors2022.html#SinghC22 %@ 978-1-6654-8464-0

@inproceedings{conf/ieeesensors/SinghC22, added-at = {2022-12-25T00:00:00.000+0100}, author = {Singh, Rajababu Udainarayan and Conde, Miguel Heredia}, biburl = {https://www.bibsonomy.org/bibtex/2fd08c8e638c0f6ef53417b1355c67d8d/dblp}, booktitle = {IEEE SENSORS}, crossref = {conf/ieeesensors/2022}, ee = {https://doi.org/10.1109/SENSORS52175.2022.9967293}, interhash = {f56852a3d5486363945b1cf8aeacc22b}, intrahash = {fd08c8e638c0f6ef53417b1355c67d8d}, isbn = {978-1-6654-8464-0}, keywords = {dblp}, pages = {1-4}, publisher = {IEEE}, timestamp = {2024-04-09T12:38:40.000+0200}, title = {Robust Time-of-Flight-based Material Imaging using Three-Dimensional Deep Neural Networks on Spatial Neighborhoods of Pixels.}, url = {http://dblp.uni-trier.de/db/conf/ieeesensors/ieeesensors2022.html#SinghC22}, year = 2022 }