%0 Conference Paper %1 conf/3dic/OharaNSLMBYFTK09 %A Ohara, Yuki %A Noriki, Akihiro %A Sakuma, Katsuyuki %A Lee, Kang Wook %A Murugesan, Mariappan %A Bea, Jichoel %A Yamada, Fumiaki %A Fukushima, Takafumi %A Tanaka, Tetsu %A Koyanagi, Mitsumasa %B 3DIC %D 2009 %I IEEE %K dblp %P 1-6 %T 10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2009.html#OharaNSLMBYFTK09 %@ 978-1-4244-4512-7

@inproceedings{conf/3dic/OharaNSLMBYFTK09, added-at = {2021-02-16T00:00:00.000+0100}, author = {Ohara, Yuki and Noriki, Akihiro and Sakuma, Katsuyuki and Lee, Kang Wook and Murugesan, Mariappan and Bea, Jichoel and Yamada, Fumiaki and Fukushima, Takafumi and Tanaka, Tetsu and Koyanagi, Mitsumasa}, biburl = {https://www.bibsonomy.org/bibtex/274d0ed3da8d31b9edef18bd5773cf22e/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2009}, ee = {https://doi.org/10.1109/3DIC.2009.5306532}, interhash = {fcd844ac4130d669f837bd2acf03f13d}, intrahash = {74d0ed3da8d31b9edef18bd5773cf22e}, isbn = {978-1-4244-4512-7}, keywords = {dblp}, pages = {1-6}, publisher = {IEEE}, timestamp = {2024-04-10T12:10:49.000+0200}, title = {10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2009.html#OharaNSLMBYFTK09}, year = 2009 }