%0 Journal Article %1 journals/mr/WangC16 %A Wang, Xuan %A Chung, C. Key %D 2016 %J Microelectron. Reliab. %K dblp %P 173-177 %T Mechanisms and solutions to the brittle solder joint in electroless Ni plating. %U http://dblp.uni-trier.de/db/journals/mr/mr65.html#WangC16 %V 65

@article{journals/mr/WangC16, added-at = {2020-02-22T00:00:00.000+0100}, author = {Wang, Xuan and Chung, C. Key}, biburl = {https://www.bibsonomy.org/bibtex/20956bbefaa1828f2faafaf1e8c3935ff/dblp}, ee = {https://doi.org/10.1016/j.microrel.2016.08.006}, interhash = {b87f65fcb85322a1b44cb6f1f6855024}, intrahash = {0956bbefaa1828f2faafaf1e8c3935ff}, journal = {Microelectron. Reliab.}, keywords = {dblp}, pages = {173-177}, timestamp = {2020-02-25T13:26:56.000+0100}, title = {Mechanisms and solutions to the brittle solder joint in electroless Ni plating.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr65.html#WangC16}, volume = 65, year = 2016 }