Thermoelectric modules experience performance reduction and mechanical failure due to thermomechanical stresses induced by thermal cycling. The present study subjects a thermoelectric module to thermal cycling and evaluates the evolution of its thermoelectric performance through measurements of the thermoelectric figure of merit,
%0 Journal Article
%1 noKey
%A Barako, M.T.
%A Park, W.
%A Marconnet, A.M.
%A Asheghi, M.
%A Goodson, K.E.
%D 2013
%I Springer US
%J Journal of Electronic Materials
%K InfraredMicroscopy SeebeckCoefficient ThermalConductivity Thermoelectrics ZT myown
%N 3
%P 372-381
%R 10.1007/s11664-012-2366-1
%T Thermal Cycling, Mechanical Degradation, and the Effective Figure of Merit of a Thermoelectric Module
%U http://dx.doi.org/10.1007/s11664-012-2366-1
%V 42
%X Thermoelectric modules experience performance reduction and mechanical failure due to thermomechanical stresses induced by thermal cycling. The present study subjects a thermoelectric module to thermal cycling and evaluates the evolution of its thermoelectric performance through measurements of the thermoelectric figure of merit,
@article{noKey,
abstract = {Thermoelectric modules experience performance reduction and mechanical failure due to thermomechanical stresses induced by thermal cycling. The present study subjects a thermoelectric module to thermal cycling and evaluates the evolution of its thermoelectric performance through measurements of the thermoelectric figure of merit, },
added-at = {2015-05-12T19:40:27.000+0200},
author = {Barako, M.T. and Park, W. and Marconnet, A.M. and Asheghi, M. and Goodson, K.E.},
biburl = {https://www.bibsonomy.org/bibtex/25a545d1ccc8ae2f26ebee9165d6c0d21/tennocrama},
doi = {10.1007/s11664-012-2366-1},
interhash = {3187b467fa3bb59dc122946342c3338a},
intrahash = {5a545d1ccc8ae2f26ebee9165d6c0d21},
issn = {0361-5235},
journal = {Journal of Electronic Materials},
keywords = {InfraredMicroscopy SeebeckCoefficient ThermalConductivity Thermoelectrics ZT myown},
language = {English},
number = 3,
pages = {372-381},
publisher = {Springer US},
timestamp = {2015-05-12T19:40:27.000+0200},
title = {Thermal Cycling, Mechanical Degradation, and the Effective Figure of Merit of a Thermoelectric Module},
url = {http://dx.doi.org/10.1007/s11664-012-2366-1},
volume = 42,
year = 2013
}