High-Entropy Materials - Microstructures and Properties summarizes recent developments in multicomponent materials. It discusses properties, processing, modeling, and applications of high-entropy materials, including metallic alloys and oxides. It also discusses solidification, sputtering, cryogenic treatments, CALPHAD methodology, biomedical implants, Fe-based superconductors, Fe-rich high-entropy alloys, and more.
%0 Book
%1 zhang2023entropy
%A Zhang, Yong
%D 2023
%E Zhang, Yong
%I Intechopen
%K High entropy materials
%T High entropy materials, Microstructures and properties
%U https://www.intechopen.com/books/11468
%X High-Entropy Materials - Microstructures and Properties summarizes recent developments in multicomponent materials. It discusses properties, processing, modeling, and applications of high-entropy materials, including metallic alloys and oxides. It also discusses solidification, sputtering, cryogenic treatments, CALPHAD methodology, biomedical implants, Fe-based superconductors, Fe-rich high-entropy alloys, and more.
%@ 978-1-80356-111-0
@book{zhang2023entropy,
abstract = {High-Entropy Materials - Microstructures and Properties summarizes recent developments in multicomponent materials. It discusses properties, processing, modeling, and applications of high-entropy materials, including metallic alloys and oxides. It also discusses solidification, sputtering, cryogenic treatments, CALPHAD methodology, biomedical implants, Fe-based superconductors, Fe-rich high-entropy alloys, and more.},
added-at = {2023-01-26T04:27:14.000+0100},
author = {Zhang, Yong},
biburl = {https://www.bibsonomy.org/bibtex/26bbf6414af6be7bb6f198eab99823fdb/yongzhang},
editor = {Zhang, Yong},
interhash = {67787c7b06e97a5743821d604a54f51b},
intrahash = {6bbf6414af6be7bb6f198eab99823fdb},
isbn = {978-1-80356-111-0},
keywords = {High entropy materials},
language = {English},
publisher = {Intechopen},
timestamp = {2023-04-23T16:06:15.000+0200},
title = {High entropy materials, Microstructures and properties},
url = {https://www.intechopen.com/books/11468},
year = 2023
}