%0 Journal Article %1 noauthororeditor %A M.Anandan, %A Kumar, N.Suresh %A P.Rajeswari, %A A.Gobinath, %D 2014 %J Electrical Engineering: An International Journal (EEIJ) %K Coupling Inclination Non-parallel Via guard microstriplines stitch %N 1 %P 27-35 %T ANALYSIS OF ELECTROMAGNETIC COUPLING BETWEEN TWO NON-PARALLEL MICROSTRIP LINES ON A HIGH SPEED PRINTED CIRCUIT BOARD %U http://airccse.com/eeij/papers/1114eeij04.pdf %V 1 %X Coupling among interconnects and PCB traces is a major limiting factor of signal quality in high speed digital system. This paper evaluates a possible way of far-end coupling reduction in a special geometry of traces. In this work, via stitch guard is constructed between the non- parallel microstrip lines to control the coupling. In a practical high speed printed circuit board, coupling between non-parallel traces is common. The effects of via stitch guard for alleviating the coupling are investigated. The coupling is controlled by adjusting the inclination of any one of the line. The results are compared with conventional traces. Some design guidelines for proper inclination angle of line for reducing the far-end coupling are concluded.

@article{noauthororeditor, abstract = {Coupling among interconnects and PCB traces is a major limiting factor of signal quality in high speed digital system. This paper evaluates a possible way of far-end coupling reduction in a special geometry of traces. In this work, via stitch guard is constructed between the non- parallel microstrip lines to control the coupling. In a practical high speed printed circuit board, coupling between non-parallel traces is common. The effects of via stitch guard for alleviating the coupling are investigated. The coupling is controlled by adjusting the inclination of any one of the line. The results are compared with conventional traces. Some design guidelines for proper inclination angle of line for reducing the far-end coupling are concluded. }, added-at = {2018-05-31T12:33:09.000+0200}, author = {M.Anandan and Kumar, N.Suresh and P.Rajeswari and A.Gobinath}, biburl = {https://www.bibsonomy.org/bibtex/2af986bf1c81e3d6faa1edb0866d58896/eeijisnowonline}, interhash = {89421e56572609f0b5e5e18025a766c8}, intrahash = {af986bf1c81e3d6faa1edb0866d58896}, issn = {2349 - 3739}, journal = {Electrical Engineering: An International Journal (EEIJ)}, keywords = {Coupling Inclination Non-parallel Via guard microstriplines stitch}, language = {English}, month = jun, number = 1, pages = {27-35}, timestamp = {2018-05-31T12:33:09.000+0200}, title = {ANALYSIS OF ELECTROMAGNETIC COUPLING BETWEEN TWO NON-PARALLEL MICROSTRIP LINES ON A HIGH SPEED PRINTED CIRCUIT BOARD }, url = {http://airccse.com/eeij/papers/1114eeij04.pdf}, volume = 1, year = 2014 }