%0 Conference Paper %1 conf/asicon/HeZQCT17 %A He, Wei %A Zhao, Hengyang %A Qi, Zhongdong %A Chen, Hai-Bao %A Tan, Sheldon X.-D. %B ASICON %D 2017 %E Qin, Yajie %E Hong, Zhiliang %E Tang, Ting-Ao %I IEEE %K dblp %P 76-79 %T Fast two-dimensional finite element analysis for power network DC integrity checks of PCBs. %U http://dblp.uni-trier.de/db/conf/asicon/asicon2017.html#HeZQCT17 %@ 978-1-5090-6625-4

@inproceedings{conf/asicon/HeZQCT17, added-at = {2018-01-17T00:00:00.000+0100}, author = {He, Wei and Zhao, Hengyang and Qi, Zhongdong and Chen, Hai-Bao and Tan, Sheldon X.-D.}, biburl = {https://www.bibsonomy.org/bibtex/239a7b2339d3f1d7145976dde5c293dcc/dblp}, booktitle = {ASICON}, crossref = {conf/asicon/2017}, editor = {Qin, Yajie and Hong, Zhiliang and Tang, Ting-Ao}, ee = {https://doi.org/10.1109/ASICON.2017.8252415}, interhash = {2bd224b30dd4c3ef9f76f68faf686291}, intrahash = {39a7b2339d3f1d7145976dde5c293dcc}, isbn = {978-1-5090-6625-4}, keywords = {dblp}, pages = {76-79}, publisher = {IEEE}, timestamp = {2018-01-18T11:40:09.000+0100}, title = {Fast two-dimensional finite element analysis for power network DC integrity checks of PCBs.}, url = {http://dblp.uni-trier.de/db/conf/asicon/asicon2017.html#HeZQCT17}, year = 2017 }