Please log in to take part in the discussion (add own reviews or comments).
Cite this publication
More citation styles
- please select -
%0 Journal Article
%1 journals/mr/LimCYCGC14
%A Lim, Adeline B. Y.
%A Chang, Andrew C. K.
%A Yauw, Oranna
%A Chylak, Bob
%A Gan, Chee Lip
%A Chen, Zhong
%D 2014
%J Microelectron. Reliab.
%K dblp
%N 11
%P 2555-2563
%T Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters.
%U http://dblp.uni-trier.de/db/journals/mr/mr54.html#LimCYCGC14
%V 54
@article{journals/mr/LimCYCGC14,
added-at = {2020-02-22T00:00:00.000+0100},
author = {Lim, Adeline B. Y. and Chang, Andrew C. K. and Yauw, Oranna and Chylak, Bob and Gan, Chee Lip and Chen, Zhong},
biburl = {https://www.bibsonomy.org/bibtex/2710a5367de4176efd9b96b82baa9c592/dblp},
ee = {https://doi.org/10.1016/j.microrel.2014.05.005},
interhash = {2ea6106652c109afdcb09a65d10b0d7b},
intrahash = {710a5367de4176efd9b96b82baa9c592},
journal = {Microelectron. Reliab.},
keywords = {dblp},
number = 11,
pages = {2555-2563},
timestamp = {2020-02-25T13:29:55.000+0100},
title = {Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters.},
url = {http://dblp.uni-trier.de/db/journals/mr/mr54.html#LimCYCGC14},
volume = 54,
year = 2014
}