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%0 Generic
%1 Hagiwara1998
%A Hagiwara, S.
%A Saitoh, H.
%A Sashima, H.
%A Huber, P.
%A Deubzer, B.
%A Geck, M.
%D 1998
%K imported
%N 5739217
%T Epoxy resin molding for sealing electronic parts containing organic
polymer-grafted silicone
%U http://www.freepatentsonline.com/5739217.html
@patent{Hagiwara1998,
added-at = {2009-11-05T12:01:24.000+0100},
author = {Hagiwara, S. and Saitoh, H. and Sashima, H. and Huber, P. and Deubzer, B. and Geck, M.},
bibtexkey = {Hagiwara1998},
biburl = {https://www.bibsonomy.org/bibtex/28e926a91a0382acaadafd6c5d005ed48/ghuot},
file = {Hagiwara1998.pdf:composite\\Hagiwara1998.pdf:PDF},
interhash = {42bb8b97dbc67e99e8e6dcb621df0577},
intrahash = {8e926a91a0382acaadafd6c5d005ed48},
keywords = {imported},
month = {April},
number = 5739217,
timestamp = {2009-11-05T12:01:28.000+0100},
title = {Epoxy resin molding for sealing electronic parts containing organic
polymer-grafted silicone},
url = {http://www.freepatentsonline.com/5739217.html},
year = 1998
}