%0 Conference Paper %1 conf/asap/WangYHA21 %A Wang, Xinyuan %A Yu, Tianyi %A Hsiao, Hsuan %A Anderson, Jason Helge %B ASAP %D 2021 %I IEEE %K dblp %P 242-249 %T Double-Pumping the Interconnect for Area Reduction in Coarse-Grained Reconfigurable Arrays. %U http://dblp.uni-trier.de/db/conf/asap/asap2021.html#WangYHA21 %@ 978-1-6654-2701-2

@inproceedings{conf/asap/WangYHA21, added-at = {2023-08-04T00:00:00.000+0200}, author = {Wang, Xinyuan and Yu, Tianyi and Hsiao, Hsuan and Anderson, Jason Helge}, biburl = {https://www.bibsonomy.org/bibtex/2bb537730e71267f18416efd3f6474003/dblp}, booktitle = {ASAP}, crossref = {conf/asap/2021}, ee = {https://doi.org/10.1109/ASAP52443.2021.00043}, interhash = {58d81ba0f1d937920d9b6987e3370c9f}, intrahash = {bb537730e71267f18416efd3f6474003}, isbn = {978-1-6654-2701-2}, keywords = {dblp}, pages = {242-249}, publisher = {IEEE}, timestamp = {2024-04-09T22:47:37.000+0200}, title = {Double-Pumping the Interconnect for Area Reduction in Coarse-Grained Reconfigurable Arrays.}, url = {http://dblp.uni-trier.de/db/conf/asap/asap2021.html#WangYHA21}, year = 2021 }