%0 Book Section %1 Hemken.2011c %A Hemken, G. %A Böhm, S. %A Dilger, K. %B Design and Manufacturing of Active Microsystems %C Berlin and Heidelberg %D 2011 %E Büttgenbach, Stephanus %E Burisch, Arne %E Hesselbach, Jürgen %I Springer-Verlag Berlin Heidelberg %K (Engineering) Engineering Nanotechnology Structural control %P 327--343 %T Use of Hot Melt Adhesives for the Assembly of Microsystems

@incollection{Hemken.2011c, added-at = {2014-03-10T21:14:47.000+0100}, address = {Berlin and Heidelberg}, author = {Hemken, G. and B{\"o}hm, S. and Dilger, K.}, biburl = {https://www.bibsonomy.org/bibtex/220d4a85332ea8bc27a6dfeb202da48da/konker}, booktitle = {Design and Manufacturing of Active Microsystems}, editor = {B{\"u}ttgenbach, Stephanus and Burisch, Arne and Hesselbach, J{\"u}rgen}, interhash = {5f8ce869c34a362ba069ef801c5a4c5c}, intrahash = {20d4a85332ea8bc27a6dfeb202da48da}, keywords = {(Engineering) Engineering Nanotechnology Structural control}, pages = {327--343}, publisher = {Springer-Verlag Berlin Heidelberg}, timestamp = {2014-03-10T21:14:47.000+0100}, title = {Use of Hot Melt Adhesives for the Assembly of Microsystems}, year = 2011 }