%0 Conference Paper %1 conf/irps/ParkHLSKKKKJHKR15 %A Park, Jongwoo %A Hong, Jungpyo %A Lee, Miji %A Sun, Dongyoon %A Kang, Kyung %A Kim, Taesung %A Kim, Seungwon %A Kwon, Sujin %A Joo, Changkyu %A Ha, Sangsu %A Kim, Wooyeon %A Ryu, Jongsu %A Pae, Sangwoo %B IRPS %D 2015 %I IEEE %K dblp %P 3 %T Contact resistance of solder bump with low cost photosensitive polyimide for high performance SoC. %U http://dblp.uni-trier.de/db/conf/irps/irps2015.html#ParkHLSKKKKJHKR15 %@ 978-1-4673-7362-3

@inproceedings{conf/irps/ParkHLSKKKKJHKR15, added-at = {2024-03-04T00:00:00.000+0100}, author = {Park, Jongwoo and Hong, Jungpyo and Lee, Miji and Sun, Dongyoon and Kang, Kyung and Kim, Taesung and Kim, Seungwon and Kwon, Sujin and Joo, Changkyu and Ha, Sangsu and Kim, Wooyeon and Ryu, Jongsu and Pae, Sangwoo}, biburl = {https://www.bibsonomy.org/bibtex/28593f5c0af2d0f98825f130595874f76/dblp}, booktitle = {IRPS}, crossref = {conf/irps/2015}, ee = {https://doi.org/10.1109/IRPS.2015.7112790}, interhash = {7709979e0981f7ecda1363b7edf36040}, intrahash = {8593f5c0af2d0f98825f130595874f76}, isbn = {978-1-4673-7362-3}, keywords = {dblp}, pages = 3, publisher = {IEEE}, timestamp = {2024-04-10T16:54:51.000+0200}, title = {Contact resistance of solder bump with low cost photosensitive polyimide for high performance SoC.}, url = {http://dblp.uni-trier.de/db/conf/irps/irps2015.html#ParkHLSKKKKJHKR15}, year = 2015 }