%0 Conference Paper %1 conf/isqed/KumariCM23 %A Kumari, Vandana %A Chandrakar, Maya %A Majumder, Manoj Kumar %B ISQED %D 2023 %I IEEE %K dblp %P 1-6 %T Performance Analysis of Cylindrical Through Silicon Via with Interfacial Crack. %U http://dblp.uni-trier.de/db/conf/isqed/isqed2023.html#KumariCM23 %@ 979-8-3503-3475-3

@inproceedings{conf/isqed/KumariCM23, added-at = {2023-06-01T00:00:00.000+0200}, author = {Kumari, Vandana and Chandrakar, Maya and Majumder, Manoj Kumar}, biburl = {https://www.bibsonomy.org/bibtex/2063364baf6fe93035720155c485f09cf/dblp}, booktitle = {ISQED}, crossref = {conf/isqed/2023}, ee = {https://doi.org/10.1109/ISQED57927.2023.10129400}, interhash = {7d4901d092340ffcbefe3d7fe3cc2202}, intrahash = {063364baf6fe93035720155c485f09cf}, isbn = {979-8-3503-3475-3}, keywords = {dblp}, pages = {1-6}, publisher = {IEEE}, timestamp = {2024-04-09T23:27:48.000+0200}, title = {Performance Analysis of Cylindrical Through Silicon Via with Interfacial Crack.}, url = {http://dblp.uni-trier.de/db/conf/isqed/isqed2023.html#KumariCM23}, year = 2023 }