%0 Journal Article %1 Pan:Bonding %A Pan, C-T %A Yang, H %A Shen, S-C %A Chou, M-C %A Chou, H-P %D 2002 %J Journal of Micromechanics and Microengineering %K imported %N 5 %P 611-615 %T A low-temperature wafer bonding technique using patternable materials %U http://stacks.iop.org/0960-1317/12/611 %V 12 %X In this paper we present a silicon wafer bonding technique for 3D microstructures using MEMS process technology. Photo-definable material with patternable characteristics served as the bonding layer between the silicon wafers. A bonding process was developed and several types of photo-definable material were tested for bonding strength and pattern spatial resolution. The results indicated that SU-8 is the best material with a bonding strength of up to 213 kg cm$^−2$ (20.6 MPa), and a spatial resolution of 10 μm, at a layer thickness of up to 100 μm. The low-temperature bonding technique that is presented is particularly suitable for microstructure and microelectronics integration involved in MEMS packaging.

@article{Pan:Bonding, abstract = {In this paper we present a silicon wafer bonding technique for 3D microstructures using MEMS process technology. Photo-definable material with patternable characteristics served as the bonding layer between the silicon wafers. A bonding process was developed and several types of photo-definable material were tested for bonding strength and pattern spatial resolution. The results indicated that SU-8 is the best material with a bonding strength of up to 213 kg cm$^{\−2}$ (20.6 MPa), and a spatial resolution of 10 \μm, at a layer thickness of up to 100 \μm. The low-temperature bonding technique that is presented is particularly suitable for microstructure and microelectronics integration involved in MEMS packaging. }, added-at = {2009-07-13T16:53:55.000+0200}, author = {Pan, C-T and Yang, H and Shen, S-C and Chou, M-C and Chou, H-P}, biburl = {https://www.bibsonomy.org/bibtex/291c214fd559be65febbe640b15a6298d/enodev}, description = {rfmems}, interhash = {8166d25749521e65cc96f96288284154}, intrahash = {91c214fd559be65febbe640b15a6298d}, journal = {Journal of Micromechanics and Microengineering}, keywords = {imported}, number = 5, pages = {611-615}, timestamp = {2009-07-14T08:40:47.000+0200}, title = {A low-temperature wafer bonding technique using patternable materials}, url = {http://stacks.iop.org/0960-1317/12/611}, volume = 12, year = 2002 }