%0 Conference Paper %1 conf/cecnet/HuYWWSWZHHH23 %A Hu, Yongfang %A Yan, Kun %A Wang, Ziyuan %A Wang, Liuwei %A Sun, Yipeng %A Wang, Yuefei %A Zhang, Xinlong %A Han, Zongjie %A Huang, Qingan %A Han, Lei %B CECNet %D 2023 %E Tallón-Ballesteros, Antonio J. %E Cortés-Ancos, Estefanía %E García, Diego A. López %I IOS Press %K dblp %P 542-548 %T Hermetic Interlayer Interconnection Technology Based on SAC305 Solder Paste. %U http://dblp.uni-trier.de/db/conf/cecnet/cecnet2023.html#HuYWWSWZHHH23 %V 381 %@ 978-1-64368-481-9

@inproceedings{conf/cecnet/HuYWWSWZHHH23, added-at = {2024-01-31T00:00:00.000+0100}, author = {Hu, Yongfang and Yan, Kun and Wang, Ziyuan and Wang, Liuwei and Sun, Yipeng and Wang, Yuefei and Zhang, Xinlong and Han, Zongjie and Huang, Qingan and Han, Lei}, biburl = {https://www.bibsonomy.org/bibtex/26ddc3a9df97d49b8600303be54a15a55/dblp}, booktitle = {CECNet}, crossref = {conf/cecnet/2023}, editor = {Tallón-Ballesteros, Antonio J. and Cortés-Ancos, Estefanía and García, Diego A. López}, ee = {https://doi.org/10.3233/FAIA231236}, interhash = {848c52743247bade13857b03890e5dbf}, intrahash = {6ddc3a9df97d49b8600303be54a15a55}, isbn = {978-1-64368-481-9}, keywords = {dblp}, pages = {542-548}, publisher = {IOS Press}, series = {Frontiers in Artificial Intelligence and Applications}, timestamp = {2024-04-10T01:50:23.000+0200}, title = {Hermetic Interlayer Interconnection Technology Based on SAC305 Solder Paste.}, url = {http://dblp.uni-trier.de/db/conf/cecnet/cecnet2023.html#HuYWWSWZHHH23}, volume = 381, year = 2023 }