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%0 Conference Paper
%1 conf/irps/WuNCDQB19
%A Wu, Zhuo-Jie
%A Nayini, Manish
%A Carey, Charles
%A Donovan, Samantha
%A Questad, David
%A Blackshear, Edmund D.
%B IRPS
%D 2019
%I IEEE
%K dblp
%P 1-7
%T CPI Reliability Challenges of Large Flip Chip Packages and Effects of Kerf Size and Substrate.
%U http://dblp.uni-trier.de/db/conf/irps/irps2019.html#WuNCDQB19
%@ 978-1-5386-9504-3
@inproceedings{conf/irps/WuNCDQB19,
added-at = {2019-05-31T00:00:00.000+0200},
author = {Wu, Zhuo-Jie and Nayini, Manish and Carey, Charles and Donovan, Samantha and Questad, David and Blackshear, Edmund D.},
biburl = {https://www.bibsonomy.org/bibtex/2f0d25b16ccc31eb27b8d96e3738e10e3/dblp},
booktitle = {IRPS},
crossref = {conf/irps/2019},
ee = {https://doi.org/10.1109/IRPS.2019.8720530},
interhash = {924669fa6b55806ab23c1cf245136bb6},
intrahash = {f0d25b16ccc31eb27b8d96e3738e10e3},
isbn = {978-1-5386-9504-3},
keywords = {dblp},
pages = {1-7},
publisher = {IEEE},
timestamp = {2019-10-17T14:45:22.000+0200},
title = {CPI Reliability Challenges of Large Flip Chip Packages and Effects of Kerf Size and Substrate.},
url = {http://dblp.uni-trier.de/db/conf/irps/irps2019.html#WuNCDQB19},
year = 2019
}
