%0 Conference Paper %1 conf/hotchips/LinTHHCYFZCLCKT16 %A Lin, Mu-Shan %A Tsai, Chien-Chun %A Hsieh, Kenny Cheng-Hsiang %A Huang, Wen-Hung %A Chen, Yu-Chi %A Yang, Shu-Chun %A Fu, Chin-Ming %A Zhan, Hao-Jie %A Chien, Jinn-Yeh %A Li, Shao-Yu %A Chen, Y.-H. %A Kuo, C.-C. %A Tai, Shih-Peng %A Yamada, Kazuyoshi %B Hot Chips Symposium %D 2016 %I IEEE %K dblp %P 1-32 %T A 16nm 256-bit wide 89.6GByte/s total bandwidth in-package interconnect with 0.3V swing and 0.062pJ/bit power in InFO package. %U http://dblp.uni-trier.de/db/conf/hotchips/hotchips2016.html#LinTHHCYFZCLCKT16 %@ 978-1-5090-6208-9

@inproceedings{conf/hotchips/LinTHHCYFZCLCKT16, added-at = {2020-04-02T00:00:00.000+0200}, author = {Lin, Mu-Shan and Tsai, Chien-Chun and Hsieh, Kenny Cheng-Hsiang and Huang, Wen-Hung and Chen, Yu-Chi and Yang, Shu-Chun and Fu, Chin-Ming and Zhan, Hao-Jie and Chien, Jinn-Yeh and Li, Shao-Yu and Chen, Y.-H. and Kuo, C.-C. and Tai, Shih-Peng and Yamada, Kazuyoshi}, biburl = {https://www.bibsonomy.org/bibtex/2c0947effa79ad579f74b78c2899ab42b/dblp}, booktitle = {Hot Chips Symposium}, crossref = {conf/hotchips/2016}, ee = {https://doi.org/10.1109/HOTCHIPS.2016.7936211}, interhash = {f1fe043bcd3b2fa2bff0f42bb06bf00e}, intrahash = {c0947effa79ad579f74b78c2899ab42b}, isbn = {978-1-5090-6208-9}, keywords = {dblp}, pages = {1-32}, publisher = {IEEE}, timestamp = {2020-04-03T12:07:27.000+0200}, title = {A 16nm 256-bit wide 89.6GByte/s total bandwidth in-package interconnect with 0.3V swing and 0.062pJ/bit power in InFO package.}, url = {http://dblp.uni-trier.de/db/conf/hotchips/hotchips2016.html#LinTHHCYFZCLCKT16}, year = 2016 }