From post

копировать удалить добавить публикацию в буфер
Запись сообщества
посмотреть историю данной записи
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs).

S. Mishra, S. Venkateswarlu, B. Vermeersch, M. Brunion, M. Lofrano, D. Abdi, H. Oprins, D. Biswas, O. Zografos, G. Hiblot, G. der Plas, P. Weckx, G. Hellings, J. Myers, F. Catthoor, и J. Ryckaert. IRPS, стр. 1-7. IEEE, (2023)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed.

Hansgeorg Brunion

Moritz Martens

Establishing properties of interaction systemsM. Martens. Uni Mannheim, (2009)

Ursula Moritz

Ingeborg Moritz

Karin Moritz

Другие публикации лиц с тем же именем

MemPool-3D: Boosting Performance and Efficiency of Shared-L1 Memory Many-Core Clusters with 3D Integration.M. Cavalcante, A. Agnesina, S. Riedel, M. Brunion, A. García-Ortiz, D. Milojevic, F. Catthoor, S. Lim, и L. Benini. CoRR, (2021)Hier-3D: A Hierarchical Physical Design Methodology for Face-to-Face-Bonded 3D ICs.A. Agnesina, M. Brunion, A. Ortiz, F. Catthoor, D. Milojevic, M. Komalan, M. Cavalcante, S. Riedel, L. Benini, и S. Lim. ISLPED, стр. 15:1-15:6. ACM, (2022)Impact of 3-D Integration on Thermal Performance of RISC-V MemPool Multicore SOC.S. Venkateswarlu, S. Mishra, H. Oprins, B. Vermeersch, M. Brunion, J. Han, M. Stan, D. Biswas, P. Weckx, и F. Catthoor. IEEE Trans. Very Large Scale Integr. Syst., 31 (12): 1896-1904 (декабря 2023)Power, Performance, Area and Cost Analysis of Memory-on-Logic Face-to-Face Bonded 3D Processor Designs.A. Agnesina, M. Brunion, J. Kim, A. Ortiz, D. Milojevic, F. Catthoor, M. Perumkunnil, и S. Lim. ISLPED, стр. 1-6. IEEE, (2021)On Legalization of Die Bonding Bumps and Pads for 3D ICs.S. Pentapati, A. Agnesina, M. Brunion, Y. Huang, и S. Lim. ISPD, стр. 62-70. ACM, (2023)Thermal Performance Analysis of Mempool RISC-V Multicore SoC.S. Venkateswarlu, S. Mishra, H. Oprins, B. Vermeersch, M. Brunion, J. Han, M. Stan, P. Weckx, и F. Catthoor. IEEE Trans. Very Large Scale Integr. Syst., 30 (11): 1668-1676 (2022)Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs.M. Naeim, H. Yang, P. Chen, R. Bao, A. Dekeyser, G. Sisto, M. Brunion, R. Chen, G. der Plas, E. Beyne и 1 other автор(ы). 3DIC, стр. 1-4. IEEE, (2023)MemPool-3D: Boosting Performance and Efficiency of Shared-L1 Memory Many-Core Clusters with 3D Integration.M. Cavalcante, A. Agnesina, S. Riedel, M. Brunion, A. García-Ortiz, D. Milojevic, F. Catthoor, S. Lim, и L. Benini. DATE, стр. 394-399. IEEE, (2022)Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs).S. Mishra, S. Venkateswarlu, B. Vermeersch, M. Brunion, M. Lofrano, D. Abdi, H. Oprins, D. Biswas, O. Zografos, G. Hiblot и 6 other автор(ы). IRPS, стр. 1-7. IEEE, (2023)

BibSonomy

Disambiguation

Please choose a person to relate this publication to

Hansgeorg Brunion

Moritz Martens

Ursula Moritz

Ingeborg Moritz

Karin Moritz

Другие публикации лиц с тем же именем

Disambiguation