%0 Journal Article %1 journals/ieiceee/DaiZYWC22 %A Dai, Fengwei %A Zhang, David Wei %A Yan, Yangyang %A Wang, Guojun %A Cao, Liqiang %D 2022 %J IEICE Electron. Express %K dblp %N 2 %P 20210453 %T Research on Ni3Sn4 intermetallic compound for 5μm diameter Cu/Ni/Sn-3.0Ag micro bumps. %U http://dblp.uni-trier.de/db/journals/ieiceee/ieiceee19.html#DaiZYWC22 %V 19

@article{journals/ieiceee/DaiZYWC22, added-at = {2022-04-21T00:00:00.000+0200}, author = {Dai, Fengwei and Zhang, David Wei and Yan, Yangyang and Wang, Guojun and Cao, Liqiang}, biburl = {https://www.bibsonomy.org/bibtex/29de225db525499f81747ecb5e1a554bd/dblp}, ee = {https://doi.org/10.1587/elex.18.20210453}, interhash = {2b1cd8696659b354c0af3308f82c64de}, intrahash = {9de225db525499f81747ecb5e1a554bd}, journal = {IEICE Electron. Express}, keywords = {dblp}, number = 2, pages = 20210453, timestamp = {2024-04-09T06:48:50.000+0200}, title = {Research on Ni3Sn4 intermetallic compound for 5μm diameter Cu/Ni/Sn-3.0Ag micro bumps.}, url = {http://dblp.uni-trier.de/db/journals/ieiceee/ieiceee19.html#DaiZYWC22}, volume = 19, year = 2022 }