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Disambiguation of "Cao, Liqiang"

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Research on Ni3Sn4 intermetallic compound for 5μm diameter Cu/Ni/Sn-3.0Ag micro bumps.

, , , , and . IEICE Electron. Express, 19 (2): 20210453 (2022)

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Yang Cao

Jingjing Cao

Yude Cao

Hong Cao

Weixun Cao

 

Other publications of authors with the same name

A Performance Analysis of Large Scale Scientific Computing Applications from Log Archives., , , and . IPDPS Workshops, page 406-411. IEEE, (2019)Si-based Ka-band SIW band-pass filter using wafer level manufacturing process., , , , and . IEICE Electron. Express, 18 (1): 20200414 (2021)Si-based system-in-package design with broadband interconnection for E-band applications., , , , , and . IEICE Electron. Express, 18 (8): 20210140 (2021)Antenna in package design and measurement for millimeter-wave applications in fan-out wafer-level package., , , and . IEICE Electron. Express, 19 (14): 20220122 (2022)HY-DBSCAN: A hybrid parallel DBSCAN clustering algorithm scalable on distributed-memory computers., , , and . J. Parallel Distributed Comput., (2022)Design and Implementation of Grid File Management System Hotfile., , , , , and . GCC, volume 3251 of Lecture Notes in Computer Science, page 129-136. Springer, (2004)Experimental and numerical study of 3D stacked dies under forced air cooling and water immersion cooling., , , , and . Microelectron. Reliab., (2017)Study on Magnetic Probe Calibration in Near-field Measurement System for EMI Application., , , , and . J. Electron. Test., 33 (6): 741-750 (2017)Design of a Ka-band receiver front end using Si-based system in package., , , and . IEICE Electron. Express, 18 (8): 20210100 (2021)Research on Ni3Sn4 intermetallic compound for 5μm diameter Cu/Ni/Sn-3.0Ag micro bumps., , , , and . IEICE Electron. Express, 19 (2): 20210453 (2022)