%0 Conference Paper %1 conf/ats/HuangHTCS13 %A Huang, Li-Ren %A Huang, Shi-Yu %A Tsai, Kun-Han %A Cheng, Wu-Tung %A Sunter, Stephen K. %B Asian Test Symposium %D 2013 %I IEEE Computer Society %K dblp %P 153-158 %T Mid-bond Interposer Wire Test. %U http://dblp.uni-trier.de/db/conf/ats/ats2013.html#HuangHTCS13 %@ 978-0-7695-5080-0

@inproceedings{conf/ats/HuangHTCS13, added-at = {2023-03-24T00:00:00.000+0100}, author = {Huang, Li-Ren and Huang, Shi-Yu and Tsai, Kun-Han and Cheng, Wu-Tung and Sunter, Stephen K.}, biburl = {https://www.bibsonomy.org/bibtex/251e70b9c132edb94c9622c98f417134f/dblp}, booktitle = {Asian Test Symposium}, crossref = {conf/ats/2013}, ee = {https://doi.ieeecomputersociety.org/10.1109/ATS.2013.37}, interhash = {5b653f807c035a8cb9c4118f522fbb12}, intrahash = {51e70b9c132edb94c9622c98f417134f}, isbn = {978-0-7695-5080-0}, keywords = {dblp}, pages = {153-158}, publisher = {IEEE Computer Society}, timestamp = {2024-04-10T06:36:09.000+0200}, title = {Mid-bond Interposer Wire Test.}, url = {http://dblp.uni-trier.de/db/conf/ats/ats2013.html#HuangHTCS13}, year = 2013 }