%0 Journal Article %1 journals/tie/QuWYBZ22 %A Qu, Zilian %A Wang, Wensong %A Yang, Zhengchun %A Bao, Qiwen %A Zheng, Yuanjin %D 2022 %J IEEE Trans. Ind. Electron. %K dblp %N 9 %P 9556-9565 %T High-Precision Thickness Measurement of Cu Film on Si-Based Wafer Using Erasable Printed Eddy Current Coil and High-Sensitivity Associated Circuit Techniques. %U http://dblp.uni-trier.de/db/journals/tie/tie69.html#QuWYBZ22 %V 69

@article{journals/tie/QuWYBZ22, added-at = {2022-04-27T00:00:00.000+0200}, author = {Qu, Zilian and Wang, Wensong and Yang, Zhengchun and Bao, Qiwen and Zheng, Yuanjin}, biburl = {https://www.bibsonomy.org/bibtex/2b8ee60d4f09833fcb4c05cd3b05348ba/dblp}, ee = {https://doi.org/10.1109/TIE.2021.3111570}, interhash = {81a36be4a1f89cb0f4cded7c3644bee2}, intrahash = {b8ee60d4f09833fcb4c05cd3b05348ba}, journal = {IEEE Trans. Ind. Electron.}, keywords = {dblp}, number = 9, pages = {9556-9565}, timestamp = {2024-04-08T10:31:28.000+0200}, title = {High-Precision Thickness Measurement of Cu Film on Si-Based Wafer Using Erasable Printed Eddy Current Coil and High-Sensitivity Associated Circuit Techniques.}, url = {http://dblp.uni-trier.de/db/journals/tie/tie69.html#QuWYBZ22}, volume = 69, year = 2022 }