Author of the publication

An Improved Advantage Actor-Critic Algorithm for Disassembly Line Balancing Problems Considering Tools Deterioration.

, , , , , and . SMC, page 3336-3341. IEEE, (2022)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

Multitasking parallel-machine scheduling with machine-dependent slack due-window assignment., , , , and . Int. J. Prod. Res., 57 (6): 1667-1684 (2019)The effect of intrinsic motivation and environmental cues on social creativity., , , , , , , and . Interact. Learn. Environ., 31 (4): 2063-2079 (May 2023)Logistics scheduling to minimize the sum of total weighted inventory cost and transport cost., , , , , and . Comput. Ind. Eng., (2018)Research on Emotional Experience Design of Cultural and Creative Products Based on User Needs., , and . DSIE, volume 383 of Frontiers in Artificial Intelligence and Applications, page 732-741. IOS Press, (2023)Brainstorm Optimization Algorithm with K-means Clustering for Disassembly Line Balancing Problems., , , , , and . SMC, page 1236-1241. IEEE, (2022)Research on Multi-AGVs Path Planning and Coordination Mechanism., , , , and . IEEE Access, (2020)Dynamic Jobshop Scheduling Algorithm Based on Deep Q Network., , , , and . IEEE Access, (2021)Do field-dependent individuals tend to have lower creativity than field-independent ones? The role of informational cues in electronic brainstorming., , , , , and . Interact. Learn. Environ., 31 (2): 1106-1125 (February 2023)A Hybrid MIP-CP Approach to Multistage Scheduling Problem in Continuous Casting and Hot-Rolling Processes., , , , and . IEEE Trans Autom. Sci. Eng., 16 (4): 1860-1869 (2019)An Improved Advantage Actor-Critic Algorithm for Disassembly Line Balancing Problems Considering Tools Deterioration., , , , , and . SMC, page 3336-3341. IEEE, (2022)