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Conduction and Breakdown Mechanisms in Low-k Spacer and Nitride Spacer Dielectric Stacks in Middle of Line Interconnects.

C. Wu, A. Chasin, S. Demuynck, N. Horiguchi, and K. Croes. IRPS, page 1-6. IEEE, (2020)

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Kris Demuynck

Serge Alex Cyriel Maurice Croes

Kris Verheyen

Kris Lohmann

Adolf Kris

Other publications of authors with the same name

Statistical aspects of the degradation of LDD nMOSFETs.E. Andries, R. Dreesen, K. Croes, W. Ceuninck, L. Schepper, G. Groeseneken, K. Lo, M. D'Olieslaeger, and J. D'Haen. Microelectron. Reliab., 42 (9-11): 1409-1413 (2002)Novel Low Thermal Budget CMOS RMG: Performance and Reliability Benchmark Against Conventional High Thermal Budget Gate Stack Solutions.J. Franco, H. Arimura, J. de Marneffe, S. Brus, R. Ritzenthaler, E. Litta, K. Croes, B. Kaczer, and N. Horiguchi. VLSI Technology and Circuits, page 1-2. IEEE, (2023)Novel low thermal budget gate stack solutions for BTI reliability in future Logic Device technologies : Invited paper.J. Franco, H. Arimura, J. de Marneffe, A. Vandooren, L. Ragnarsson, Z. Wu, D. Claes, E. Litta, N. Horiguchi, K. Croes and 3 other author(s). ICICDT, page 1-4. IEEE, (2021)Role of Defects in the Reliability of HfO2/Si-Based Spacer Dielectric Stacks for Local Interconnects.C. Wu, A. Chasin, A. Padovani, A. Lesniewska, S. Demuynck, and K. Croes. IRPS, page 1-6. IEEE, (2019)Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters.Y. Ding, O. Pedreira, M. Lofrano, H. Zahedmanesh, T. Chavez, H. Farr, I. Wolf, and K. Croes. IRPS, page 1-7. IEEE, (2023)High-resolution SILC measurements of thin SiO2 at ultra low voltages.S. Aresu, W. Ceuninck, R. Dreesen, K. Croes, E. Andries, J. Manca, L. Schepper, R. Degraeve, B. Kaczer, and M. D'Olieslaeger. Microelectron. Reliab., 42 (9-11): 1485-1489 (2002)Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps.A. Lesniewska, O. Pedreira, M. Lofrano, G. Murdoch, M. van der Veen, A. Dangol, N. Horiguchi, Z. Tökei, and K. Croes. IRPS, page 1-6. IEEE, (2021)Assessment of critical Co electromigration parameters.O. Pedreira, M. Lofrano, H. Zahedmanesh, P. Roussel, M. van der Veen, V. Simons, E. Chery, I. Ciofi, and K. Croes. IRPS, page 8. IEEE, (2022)TEASE: a systematic analysis framework for early evaluation of FinFET-based advanced technology nodes.A. Mallik, P. Zuber, T. Liu, B. Chava, B. Ballal, P. Bario, R. Baert, K. Croes, J. Ryckaert, M. Badaroglu and 2 other author(s). DAC, page 24:1-24:6. ACM, (2013)Insights into metal drift induced failure in MOL and BEOL.C. Wu, O. Pedreira, A. Lesniewska, Y. Li, I. Ciofi, Z. Tökei, and K. Croes. IRPS, page 3. IEEE, (2018)

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Disambiguation of "Croes, Kris"

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Conduction and Breakdown Mechanisms in Low-k Spacer and Nitride Spacer Dielectric Stacks in Middle of Line Interconnects.

Please choose a person to relate this publication to

Kris Demuynck

Serge Alex Cyriel Maurice Croes

Kris Verheyen

Kris Lohmann

Adolf Kris

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Croes, Kris"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Conduction and Breakdown Mechanisms in Low-k Spacer and Nitride Spacer Dielectric Stacks in Middle of Line Interconnects.

Please choose a person to relate this publication to

Kris Demuynck

Serge Alex Cyriel Maurice Croes

Kris Verheyen

Kris Lohmann

Adolf Kris

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
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MSOffice XML

Conduction and Breakdown Mechanisms in Low-k Spacer and Nitride Spacer Dielectric Stacks in Middle of Line Interconnects.