( en | de | ru )

 

Disambiguation of "Takemura, Ryo"

Author of the publication

copydeleteadd this publication to your clipboard
Towards explaining the cognitive efficacy of Euler diagrams in syllogistic reasoning: A relational perspective.

, , , and . J. Vis. Lang. Comput., 25 (3): 156-169 (2014)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Ryo Sugihara

Ryo Kohsaka

Jong Won Ryoo

So Young Ryou

Mun Il Ryoo

 

Other publications of authors with the same name

Economic reasoning with demand and supply graphs.. Math. Soc. Sci., (2020)Counter-Example Construction with Euler Diagrams.. Stud Logica, 103 (4): 669-696 (2015)Investigating Problems of Research and Development of Artificial Intelligence Technology in Japan., , , and . IEEM, page 750-754. IEEE, (2019)A phase semantics for polarized linear logic and second order conservativity., and . J. Symb. Log., 75 (1): 77-102 (2010)Impact of Reabsorption of Spilled Knowledge on Patent Value., , , and . IEEM, page 354-358. IEEE, (2020)An Indexed System for Multiplicative Additive Polarized Linear Logic., and . CSL, volume 5213 of Lecture Notes in Computer Science, page 262-277. Springer, (2008)Proof-Theoretical Investigation of Venn Diagrams: A Logic Translation and Free Rides.. Diagrams, volume 7352 of Lecture Notes in Computer Science, page 132-147. Springer, (2012)A Logical Investigation of Heterogeneous Reasoning with Graphs in Elementary Economics.. Diagrams, volume 9781 of Lecture Notes in Computer Science, page 98-104. Springer, (2016)Two Types of Diagrammatic Inference Systems: Natural Deduction Style and Resolution Style., , and . Diagrams, volume 6170 of Lecture Notes in Computer Science, page 99-114. Springer, (2010)Changes of Technological Knowledge Diversification within a Group of Inventors and Patent Value Corresponding to Technology Lifecycle., and . IEEM, page 1332-1336. IEEE, (2018)