( en | de | ru )

 

Disambiguation of "Chawla, Nikhilesh"

Author of the publication

copydeleteadd this publication to your clipboard
Data intensive science at synchrotron based 3D x-ray imaging facilities.

, , , , , , , and . eScience, page 1-3. IEEE Computer Society, (2012)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Jogindar Mohan Chawla

Vinod Kumar Chawla

 

Other publications of authors with the same name

Rapid method for testing efficacy of nano-engineered coatings for mitigating tin whisker growth., , , , and . Microelectron. Reliab., 55 (5): 832-837 (2015)Data intensive science at synchrotron based 3D x-ray imaging facilities., , , , , , , and . eScience, page 1-3. IEEE Computer Society, (2012)Mechanical shock behavior of Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce solder joints., and . Microelectron. Reliab., 53 (5): 733-740 (2013)Computational Imaging in 3D X-Ray Microscopy: Reconstruction, Image Segmentation and Time-Evolved Experiments., , , , , , , , , and . ICIP, page 3502-3506. IEEE, (2021)In situ tensile testing of tin (Sn) whiskers in a focused ion beam (FIB)/scanning electron microscope (SEM)., , , , , , and . Microelectron. Reliab., (2017)In situ fixture for multi-modal characterization during electromigration and thermal testing of wire-like microscale specimens., , and . Microelectron. Reliab., 55 (11): 2345-2353 (2015)Interfacial fracture toughness of Pb-free solders., , and . Microelectron. Reliab., 49 (3): 269-287 (2009)Mechanisms of deformation in high-ductility Ce-containing Sn-Ag-Cu solder alloys., , and . Microelectron. Reliab., 51 (6): 1142-1147 (2011)