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Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps., , , , , , , , and . IRPS, page 1-6. IEEE, (2021)Insights into metal drift induced failure in MOL and BEOL., , , , , , and . IRPS, page 3. IEEE, (2018)Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill., , , , , , , , , and . IRPS, page 1-6. IEEE, (2020)First demonstration of Two Metal Level Semi-damascene Interconnects with Fully Self-aligned Vias at 18MP., , , , , , , , , and 5 other author(s). VLSI Technology and Circuits, page 1-2. IEEE, (2022)Role of Defects in the Reliability of HfO2/Si-Based Spacer Dielectric Stacks for Local Interconnects., , , , , and . IRPS, page 1-6. IEEE, (2019)Method to assess the impact of LER and spacing variation on BEOL dielectric reliability using 2D-field simulations for <20nm spacing., , , , , and . IRPS, page 10-1. IEEE, (2018)Degradation mechanisms in Germanium Electro-Absorption Modulators., , , , , , , , and . IRPS, page 9. IEEE, (2022)Accelerated Device Degradation of High-Speed Ge Waveguide Photodetectors., , , , and . IRPS, page 1-7. IEEE, (2019)Towards accurate temperature prediction in BEOL for reliability assessment (Invited)., , , , , , , , , and 1 other author(s). IRPS, page 1-7. IEEE, (2023)Silicon Photonics for 56G NRZ Optical Interconnects., , , , , , , , , and 7 other author(s). OFC, page 1-3. IEEE, (2018)