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STAHL: A Novel Scan-Test-Aware Hardened Latch Design.

R. Ma, S. Holst, X. Wen, A. Yan, и H. Xu. ETS, стр. 1-6. IEEE, (2019)

Please choose a person to relate this publication to

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Aibin Liang

Yan Yan

Yan Xu

Untersuchungen zur Verleimung von Holz und Holzspanplatten mit UF-Leimharzen und PMDIY. Xu. TU Braunschweig, (2009)

Shanshan Yan

Americanization in China: an analysis of General Motors and its strategies in ChinaS. Yan. Uni Mainz, (2009)

Yan Xu

Другие публикации лиц с тем же именем

Information Assurance Through Redundant Design: A Novel TNU Error-Resilient Latch for Harsh Radiation Environment.A. Yan, Y. Hu, J. Cui, Z. Chen, Z. Huang, T. Ni, P. Girard, и X. Wen. IEEE Trans. Computers, 69 (6): 789-799 (2020)Architecture of Cobweb-Based Redundant TSV for Clustered Faults.T. Ni, D. Liu, Q. Xu, Z. Huang, H. Liang, и A. Yan. IEEE Trans. Very Large Scale Integr. Syst., 28 (7): 1736-1739 (2020)Design of a Novel Self-Recoverable SRAM Cell Protected Against Soft Errors.A. Yan, J. Zhou, Y. Hu, Y. Chen, Z. Wu, и T. Ni. DSA, стр. 497-498. IEEE, (2019)Design of Double-Upset Recoverable and Transient-Pulse Filterable Latches for Low-Power and Low-Orbit Aerospace Applications.A. Yan, Y. Chen, Z. Xu, Z. Chen, J. Cui, Z. Huang, P. Girard, и X. Wen. IEEE Trans. Aerosp. Electron. Syst., 56 (5): 3931-3940 (2020)A Soft-Error-Immune Quadruple-Node-Upset Tolerant Latch.Z. Huang, L. Duan, Y. Zhang, T. Ni, и A. Yan. IEEE Trans. Aerosp. Electron. Syst., 59 (3): 2621-2632 (июня 2023)A Novel TDMA-Based Fault Tolerance Technique for the TSVs in 3D-ICs Using Honeycomb Topology.T. Ni, Z. Yang, H. Chang, X. Zhang, L. Lu, A. Yan, Z. Huang, и X. Wen. IEEE Trans. Emerg. Top. Comput., 9 (2): 724-734 (2021)Two Double-Node-Upset-Hardened Flip-Flop Designs for High-Performance Applications.A. Yan, A. Cao, Z. Huang, J. Cui, T. Ni, P. Girard, X. Wen, и J. Zhang. IEEE Trans. Emerg. Top. Comput., 11 (4): 1070-1081 (октября 2023)Novel Low Cost, Double-and-Triple-Node-Upset-Tolerant Latch Designs for Nano-scale CMOS.A. Yan, C. Lai, Y. Zhang, J. Cui, Z. Huang, J. Song, J. Guo, и X. Wen. IEEE Trans. Emerg. Top. Comput., 9 (1): 520-533 (2021)Novel Quadruple-Node-Upset-Tolerant Latch Designs With Optimized Overhead for Reliable Computing in Harsh Radiation Environments.A. Yan, Z. Xu, X. Feng, J. Cui, Z. Chen, T. Ni, Z. Huang, P. Girard, и X. Wen. IEEE Trans. Emerg. Top. Comput., 10 (1): 404-413 (2022)Pattern Reorder for Test Cost Reduction Through Improved SVMRANK Algorithm.T. Song, H. Liang, T. Ni, Z. Huang, Y. Lu, J. Wan, и A. Yan. IEEE Access, (2020)

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Please choose a person to relate this publication to

Aibin Liang

Yan Yan

Yan Xu

Shanshan Yan

Yan Xu

Другие публикации лиц с тем же именем

Disambiguation

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копироватьудалитьдобавить публикацию в буферЗапись сообществапосмотреть историю данной записиURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML STAHL: A Novel Scan-Test-Aware Hardened Latch Design.

Please choose a person to relate this publication to

Aibin Liang

Yan Yan

Yan Xu

Shanshan Yan

Yan Xu

Другие публикации лиц с тем же именем

Disambiguation